Failure Analysis Techniques
- Failure Analysis
- Decapsulation/Delidding
- Dye and Pry Testing
- Microsectioning
- Qualification of Bare Boards and Assemblies
- Imaging
- Automated Optical Inspection
- Endoscopic Optical Inspection
- Optical Microscopy with Digital Imaging
- Metallography with Digital Imaging
- Scanning Electron Microscopy (SEM) with Energy Dispersive X-ray Spectroscopy (EDS)
- Transmission X-ray Imaging and Inspection
- Cleanliness Testing
- Bulk Ionics / Ionograph Testing
- Ion Chromatography
- Residual Rosin Testing
- Surface Organic Contamination Detection Testing
- Surface Organic Contamination Identification Testing
- Surface Insulation Resistance (SIR) Testing
- Solderability Testing
- Accelerated Steam Aging
- Dip and Look
- Solder Float Test
- Wetting Balance
- Sequential Electrochemical Reduction Analysis (SERA)
- Spectroscopic Analysis
- Energy Dispersive X-ray Spectroscopy (EDS)
- Fourier Transform Infrared (FTIR) Spectroscopy
- Ultraviolet/Visible (UV/Vis) Spectroscopy
- X-ray Fluorescence (XRF) Spectroscopy
- Thermal Analysis
- Differential Scanning Calorimetry (DSC)
- Thermal Gravimetric Analysis (TGA)
- Wire Bond Mechanical Testing
- Ball Wire Bond Shear Testing
- Wire Bond Pull Testing
- Non-Destructive Wire Bond Pull Testing
- Die Shear Testing
- Non-Destructive Testing
- Cleanliness Examination
- Visual Examination
- X-ray Examination
- Mechanical Examination
- Counterfeit Component Screening
- Solder Analysis
- Environmental Stress Screening (ESS) Testing Services
- Highly Accelerated Stress Testing (HAST)
- Mechanical Drop Shock Testing
- Salt Fog Chamber Testing
- Temperature/Humidity Cycling
- Thermal Cycling
- Thermal Shock