Chemistry/Materials Science Skill Sets
Synthetic Organic / Polymer Experience
- Carbohydrate chemistry
- Carbon-carbon bond formations
- Carbon nanotube functionalization
- Computational chemistry
- Molecular modeling and HOMO/LUMO energy level calculations
- Chem3D Ultra
- Gaussian 03
- PC Spartan
- Titan
- Molecular modeling and HOMO/LUMO energy level calculations
- Functional coatings
- Functional group transformations
- Lanthanide chemistry
- Metal-catalyzed coupling reactions
- Microwave-assisted organic synthesis
- Organometallic complex synthesis
- Oxidations and reductions
- Peptide bond formations
- Peptide chemistry
- Peptide nulceic acid (PNA) chemistry
- Polymerizations:
- Acyclic Diene Metathesis (ADMET)
- Anionic
- Condensation
- Free radical
- Metal-catalyzed coupling
- Ring Opening Metathesis Polymerization (ROMP)
- Polymer processing
- Precipitation / reprecipitation
- Drop casting of films
- Spin casting of films
- Thermal cross-linking / hardening
- UV cross-linking / hardening
- Protective group chemistry
- Schlenk line & glove box manipulations
- Moisture-sensitive compounds
- Oxygen-sensitive compounds
- Pyrophoric compounds
- Self-Assembled Monolayers (SAMs)
- Solid-phase synthesis
- Fmoc protected PNA oligomer synthesis
- tBoc protected PNA oligomer synthesis
- Surface Passivation
Purification Experience
- Chromatography / Separations Science:
- TLC / preparative TLC – alumina and silica
- Column chromatography – alumina, silica, & Florisil
- Medium-pressure chromatography – Biotage system
- High-pressure chromatography – reverse-phase
- Distillation under ambient pressure and vacuum
- Lyophilization (freeze drying)
- Reprecipitation
- Recrystallization
- Sublimation
Characterization / Instrumental Analysis Experience
- Cleanliness analysis:
- Ion Chromatography (IC) – Dionex
- Ionograph – Alpha Metals, Specialty Coating Systems
- Integrated circuit (IC) device preparation and analysis:
- IV analysis – HP 4145B Semiconductor Parameter Analyzer
- Wire bonding – Kulicke & Soffa Digital Bonder (Model 4523AD) Wedge Bonder
- Electrochemical analysis:
- Cyclic Voltammetry (CV), Electrochemical Impedence Spectroscopy (EIS), Galvanometry, etc. – Gamry Instruments, Princeton Applied Research, and others
- Microscopy:
- Confocal / Fluorescence
- Infrared – Attenuated Total Reflectance / Fourier Transform Infrared Spectroscopy (ATR/FTIR)
- Optical
- Surface analysis:
- Atomic Force Microscopy (AFM) / Conductive AFM – Digital Instruments / Veeco
- Field Emission-Scanning Electron Microscopy (FE-SEM) – Hitachi
- Scanning Electron Microscopy (SEM) – Amray
- Energy Dispersive X-Ray Spectroscopy (EDS or EDX) – EDAX
- Sequential Electrochemical Reduction Analysis (SERA) – ECI Technology
- Surface Insulation Resistance (SIR) – Alpha Metals
- Transmission X-Ray Analysis – Dage, Nikon
- Wetting Balance
- X-Ray Fluorescence (XRF) – Fischer
- Structural and purity elucidation:
- Thermal analysis:
- DSC/TGA – Shimadzu, TA Instruments
- Photophysical analysis:
- Spectrofluorometer (fluorescence and phosphorescence; UV to NIR) – Horiba / Jobin-Yvon / SPEX
- UV/Vis/NIR absorption spectrometer – Olis and others.
Data Analysis
Literature & Information Search